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Heat Dissipation

Heat Dissipation

High thermal conductivity

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Product name TB2955P TB1225B TB1225C TB2270C
Main component Silyl-based special polymer Silicone resin Silicone resin Epoxy resin
Appearance Gray White Gray Gray
Viscosity (Pa·S) 120 18.0 70.0 65.0
Tack-free time 24 hours 5 minutes 10 minutes -
Curing conditions - 7 days under 23±2°C×50%RH - 100°C×40minutes, etc.
Thermal conductivity<W/m·K> 4.8 1.59 2.5 0.93
Special remarks ·Free of low molecular siloxane
·Dielectric breakdown strength 19kV/mm
·Volume resistivity 3.1×1014Ω·m
·Low molecular weight siloxane Reduction
·Dielectric breakdown strength 2.0×104kV/m
·Volume resistivity  2×1014Ω·m
·Low molecular weight siloxane Reduction
·Dielectric breakdown strength 17.4V/mm
·Volume resistivity 1.1×1011Ω·m
·Shear strength (Iron)  21.6MPa
·Glass transition temperature  140°C
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* Measurements are taken under the standard testing conditions for each grade.

 

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