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2270 Series

The products in this series are one-part epoxy resins developed for special purposes. Each of them is for a different application.


Click on each product number to display the product detail page.
Details 2270C
One-part, low-curing-contracting, epoxy-compound resin.
Details 2274
Underfill agent for CSP or BGA mounting.
Details 2274B
Underfill agent for CSP or BGA mounting.
Details 2274C
Underfill agent for CSP or BGA mounting.
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