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ThreeBond 3373C Anisotropically-conductive adhesive for screen printing |
As electronic devices have become smaller and lighter, many components have become much denser. Examples are high-capacity, high-density displays such as LCD displays. ThreeBond 3373C is an anisotropically conductive adhesive for use in screen printing, which enables an adhesive to form efficiently an anisotropically conductive layer on a high density, multiterminal circuit. One of its most important merits is that it can be managed more easily than a thermal-curing film of anisotropically conductive adhesive, because the temperature allowable at pressure-bonding can be as high as 120 to 160°C. This adhesive is especially suitable for the connection and bonding of liquid crystal panels and membrane switches. |
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Makes screen printing possible, so that the adhesive fits the parts being connected. |
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Makes it possible to connect many contacts at the same time. |
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Provides good connection to transparent conductive glasses, which cannot be soldered. |
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Unlike conductive rubber and metal-wired rubber, requires no compressed fixing after adhesion. |
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Connection of liquid crystal panels with boards |
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Connection of membrane switches |
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Connection of EL backlight terminals |
Properties
| Product name |
3373C |
Test method |
| Properties |
Type |
One-part sublimable solvent |
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| Color and appearance |
Light yellowish green paste |
Visually |
| Major component |
Synthetic rubber-based adhesive |
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| Conductive filler |
Special composite powder |
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| Viscosity |
80Pa s |
BH-type viscometer
NO.7 x 10rpm |
| Specific gravity |
1.00 |
JIS 6835 specific gravity cup |
| Basic properties |
Connection resistance |
12Ω |
Note 1 |
| Line dielectric resistance |
109Ω |
Note 2 |
| Minimum conductor width available |
0.2mm |
|
| Adhesivity |
490N/m
(500gf/cm) |
Peeling strength |
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| Note 1: Sample form |
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FPC/ITO glass |
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FPC |
: 25μm polyimide film/35μm copper-foil/gold-plated, |
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400 μm pitch (conductor width : line width = 1:1) |
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ITO |
: Soda lime glass/ITO sputtering deposition (10Ω/sheet) |
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Pressure-bonding condition |
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2.9MPa for 10 sec at 140°C |
| Note 2: Sample form |
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FPC |
: 25μm polyimide film/35μm copper-foil gold-plated |
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400μm pitch (conductor width : line width = 1:1)/wedge-type of electrode pattern (50/50) |
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Pressure-bonding condition |
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2.9MPa for 10 sec at 140°C |
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Applied voltage |
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DC 10V |
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Measuring tool |
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Yokogawa Hewlett-Packard high-resistance measuring machine |
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