ThreeBond 3380B Two-part, epoxy-based, electroconductive adhesive

ThreeBond 3380B is a two-part, epoxy-based conductive adhesive with a very little outgas, which has been developed for electronics and electronic parts. The product cures at about 60°C.

·	Is a silver-based conductive adhesive with epoxy resin or curing agent used as a binder.
·	Has stable adhesion for metal materials.
·	Is a nonsolvent type that leaves no solvent residue in the adhesive.
·	Is ideal for sealing because of the low outgassing.
·	Cures at low temperature, 60 to 80°C.

·	Connecting electrodes in various electronics and electronic parts
·	Dot adhesion and fixing of electronic chips

Properties before curing

Items	Units	Properties		Test method
Items	Units	Main agent	Curing agent	Test method
Color and appearance	-	Silver paste	Gray paste	3TS-201-01
Viscosity at 25°C	Pa s (P)	31 (310)	2.9 (29)	3TS-210-03TS-210-05 :EHD-type viscometer at 0.5rpm
Viscosity at 25°C	Pa s (P)	28 (280)	2.5 (25)	3TS-210-02 :BE-type viscometer at 20rpm
Specific gravity at 25°C	-	3.7	3.2	3TS-213-02
Viscosity after mixture of two agents at 25°C	Pa s (P)	23 (230)		3TS-210-05 :EHD-type viscometer at 0.5rpm

Properties after curing for 3 hours in a dry hot-air oven heated to 60°C

	Items	Units	Attribute	Test method
Basic properties	Chip adhesive strength	MPa (kgf/cm²)	19.5 (198)	3TS-310-02 (Ceramic chip-glass plate)
	Volume resistivity	Ω m (Ω cm)	1.5 x 10^-5 (1.5 x 10^-3)	3TS-401-03
	Pencil hardness	-	5H	3TS-215-05
	Loss on heating test (TG method)	%	0.09	3TS-501-03 (120°C x 1 hour aging)
	Curing condition	Main agent: curing agent = 2:1 (mass ratio) Curing condition: 60°C x 3 hours (in a hot-air dry oven)

Curing condition: Main agent : curing agent = 2:1 (mass ratio); Curing condition 60°C x 3 hours (in a hot-air dry oven)