ThreeBond 2955 Moisture-curing, heat-dissipating resin

ThreeBond 2955 is a moisture-curing resin with a base of silyl and a special polymer, compounded with a thermal conductive filler. It is used for heat dissipation. As soon as it is applied, it starts curing from the surface. When cured, it provides excellent properties as a heat radiator and as a dielectric.

·	Has excellent thermal conductivity.
·	Has excellent dielectric property.
·	Contains no low-molecular siloxane.
·	Undergoes membrane curing from the surface, and therefore allows less liquid drip-down after parts treated with it are assembled.

·	Insulation and heat dissipation for power-switching units
·	Insulation and heat dissipation for power ICs
·	Heat dissipation from computer CPUs
·	Insulation and heat dissipation for inverters for lights
·	Thermal conductivity and insulation of heaters
·	Insulation and heat dissipation for various electronic parts

Properties

Items	Units	Properties	Test method
Color	-	Gray	3TS-201-02
Viscosity	Pa s	300	3TS-210-02 (Rotor no.7 at 10rpm)
Specific gravity	-	2.7	3TS-213-02
Tack time	hr	<72	3TS-219-04

General properties

Items	Units	Attributes	Test method
Heat conductance	W/m K	3.0	3TS-501-07
Dielectric breakdown strength	kV/m	1.5 x 10⁴	3TS-406-01
Volume resistivity	Ωm	6.4 x 10¹⁰	3TS-401-01