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Because of the high quality of its chemical technology, ThreeBond has earned a place in the top level of Japanese providers of industrial sealants and adhesives in Japan. Never content to accept things as they are, ThreeBond works to make sure that its technologies evolve as needed to meet customers' widely different requirements. Here we introduce ThreeBond's technologies in all of their multifaceted variety.
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 PICK UP technology
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We would like to introduce the essence of ThreeBond's technologies, including the latest ones, which are becoming very popular in Japanese industry. |
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Technical seminar for engineers |
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The proceedings of seminars held by ThreeBond are presented here. They are readily available as technical documentation. |
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Liquid gasket  |
| Here we introduce liquid gaskets, which are applied to the joints of pipes or other equipment so that, when the joints are tightened, fluid inside the equipment is prevented from leaking. |
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TECHNICAL NEWS |
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TECHNICAL NEWS presents technical information from ThreeBond in what we hope is an understandable and interesting way. |
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| Latest issue No. 75 Screen Printable Anisotropic Conductive Paste (ACP) |
ThreeBond’s Anisotropic Conductive Paste (ACP) is a liquid material consisting of electroconductive particles uniformly dispersed within a highly-insulating adhesive component. A functional material, ACP produces an anisotropic conductive film through application and drying in the screen-printing process. It is capable of achieving all three of the following actions at a physical junction through a heat press process for several ten seconds: (1) forming an electric connection between electronic components; (2) retaining insulation between adjacent electrodes; and (3) bonding and fixing.
ThreeBond has pursued research and development related to ACP for the past 30 years, introducing products that have drawn wide acclaim in markets for heat seal connectors, display devices, cell phone backlights, membrane switches, and touch panels, among others. During this time, the development of increasingly advanced high-function electronic components has significantly altered expectations for ACP. In addition to high reliability and functionality, the market now demands increased usability, increased storability over extended periods, and compatibility with environmental standards that require, for example, halogen-free and toluene-free products.
This issue discusses the traits that distinguish our ACP from other connector materials and argues for ACP’s superiority. It also introduces products (the ThreeBond3373 series) developed to comply with market demands and environmental requirements. |
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