ThreeBond 2955P

Moisture-curing heat-dissipating resin PICK UP

Market

  • Automotive Market

    Used for vehicle powertrains and electrical components, construction machines, and marine vessels.

  • Electronics Market

    Used for electrical appliances such as mobile phones and computers.

  • Public Industrial Material Market

    Used for infrastructure, construction, and general machines.

Function

  • Elastic adhesives

  • Flexibility

  • High thermal conductivity

  • Moisture-curing

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Features / Technology

  • High heat dissipation
  • Not containing low-molecular cyclic siloxane
Main component Thermally conductive filler resin containing silyl-based special polymer
Exterior Gray
Viscosity 120Pa･s

Examples

Various electronic parts

Heat dissipation

Related product

Related Links

Online Catalog by market: Electronics related Products Guide （別窓で開く）