ThreeBond 2270J

High-heat-dissipation, one-component, heat-curable epoxy-compound resin

Market
  • Automotive Market

    Used for vehicle powertrains and electrical components, construction machines, and marine vessels.

  • Electronics Market

    Used for electrical appliances such as mobile phones and computers.

  • Public Industrial Material Market

    Used for infrastructure, construction, and general machines.

Function
  • Excellent Heat resistance

  • Heat curing

  • Heat resistance

  • High Tg

  • High strength

  • High thermal conductivity

  • Precise fixing

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Features / Technology

  • One-component, heat-curable adhesive
  • High thermal conductivity
  • Low linear expansion coefficient and cure shrinkage
  • Excellent low temperature curability and durability
Main component Epoxy resin
Exterior White
Viscosity 150Pa・s

Examples

Electronic components requiring heat dissipation

Bonding and potting

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