ThreeBond 3303G(NEO)(S)
One-component, Silicone-based Conductive Adhesive for SMD Crystal Oscillators, Ag Paste PICK UP
- Market
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Electronics Market
Used for electrical appliances such as mobile phones and computers.
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- Function
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Flexibility
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Heat curing
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Heat curing / Drying performance
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Features / Technology
- Curable at 180 °C for 1 hour
- Excelling in stress relaxation because of softness after curing
- Good adhesion to gold-plated and silver-plated substrates
| Main component | Silicone based |
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| Exterior | Silver |
| Viscosity | 40.0Pa･s |
Examples
Piezoelectric elements and electrodes of small crystal units
Connection
Piezoelectric elements and electrodes of crystal oscillators
Connection
Piezoelectric elements and electrodes of surface acoustic wave filters
Connection
Fixing of chips
Spot-bonding
Other components
Spot-bonding