In recent years, electronic devices and sensors have become more flexible, and the use of non-heat resistant materials such as resin is increasing. Therefore, the conductive resin used is also required to have low temperature curability of 100°C or less. In addition, the bonding between the resin material and the metal requires elongation after curing that can follow the difference in linear expansion of the materials, and a flexible conductive resin that does not easily crack when dropped.
- Can be cured at a low temperature of 100°C or less.
- The cured product is soft.
- It does not break and has conductivity even when stretched 100%.
- It can follow the expansion and contraction of the material.
- Grounding between dissimilar materials with a large difference in coefficient of thermal expansion
- Grounding of flexible devices and circuit formation
- Mounting electronic components on a flexible board
- Circuit formation of moving parts
Assuming the response to linear expansion differences between dissimilar materials and application to flexible devices, we have proceeded with the development of a resin that has flexibility not found in conventional products and has conductivity even when deformed. We have succeeded in developing a new product that is softer and more stretchable than before by selecting a silicone resin material that is soft and stretchable as the base polymer and by using a special conductive filler. In addition, by optimizing the curing catalyst, low temperature curing of 100°C or less is achieved.
When a force is applied to conventional product and the ThreeBond3333F, the conventional product cannot withstand the deformation and breaks, whereas the ThreeBond3333F follows and deforms without breaking due to the force.